creat by art ? glass passivated junction chip. ? for surface mounted application ? low forward voltage drop ? low profile package ? fast switching for high efficiency BYG20D sma 1.8k / 7" reel r3 maximum ratings and el ectrical characteristics rating at 25 ambient temperature unless otherwise specified. single phase, half wave, 60 hz, resistive or inductive load. for capacitive load, derate current by 20% symbol unit v rrm v v rms v v dc v i f(av) a trr ns r ja o c/w t j o c t stg o c 400 600 byg20g byg20j 200 400 600 140 280 420 BYG20D - byg20j sma/do-214ac features ? built-in stain relief, ideal for automatic placement ? high temperature soldering: 260 /10 seconds at terminals 1.5 amps high efficient su rface mount rectifiers ? plastic material used carries underwriters laboratory classification 94v-0 ? green compound with suffix "g" on packing code & prefix "g" on datecode mechanical data ? case: molded plastic ? terminal: pure tin plated, lead free ? polarity: indicated by cathode band ? packing: 12mm tape per eia std rs-481 ? weight: 0.064 grams type number maximum repetitive peak reverse voltage maximum rms voltage maximum dc blocking voltage r3g BYG20D 200 ordering information (example) maximum average forward rectified current 1.5 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load (jedec method) i fsm 30 a v f v 1.3 1.4 maximum reverse current @ rated vr t a =25 t a =100 i r 1 ua 10 maximum reverse recovery time (note 2) 75 typical thermal resistance 100 operating temperature range - 55 to + 150 storage temperature range - 55 to + 150 note 1: pulse test with pw=300 usec, 1% duty cycle note 2: reverse recovery test conditions: i f =0.5a, i r =1.0a, i rr =0.25a version:a13 mj 20 part no. package packing packing code packing code (green) pulse energy in avalanche mode, non repetitive (inductive load switch off ) t a =25 , l=120mh e rsm maximum instantaneous @ 1.0 a forward voltage (note 1) @ 1.5 a
version:a13 ratings and characteristic curves (BYG20D thru byg20j) 0 0.5 1 1.5 2 0 20406080100120140160 average forward current (a) lead temperature ( o c) fig.1 forward current derating curve resistive or inductive load 0 10 20 30 40 50 60 70 1 10 100 peak forward surge urrent (a) number of cycles at 60 hz fig. 3 maximum non-repetitive forward surge current 8.3ms single half sine wave jedec method ta=25 0.001 0.01 0.1 1 10 100 0 20 40 60 80 100 120 140 instantaneous reverse current (ua) percent of rated peak reverse voltage (%) fig. 2 typical reverse characteristics ta=25 ta=125 0 25 50 75 100 125 150 175 0.1 1 10 100 1000 capacitance (pf) reverse voltage (v) fig. 4 typical junction capacitance ta=25 0.1 1 10 0.4 0.6 0.8 1 1.2 1.4 1.6 instantaneous forward current (a) forward voltage (v) fig. 5 typical forward characteristics ta=25
sma r3 sma r2 sma m2 folded sma f3 folded sma f2 folded sma f4 c sma e3 c sma e2 tape & reel specification abcdngt 2.0 0.4 +0.5;-0.2 min 1.0 +0.8;-0 max 7" 12mm 178 1.9 13 21 62 12.2 14.6 abcdngt max 0.5 0.5 min 0.5 +2.0;-0 max 13" 12mm 330 2 13 20.2 75 12.4 18.4 unit (mm) ordering information part no. package packing packing code packing code (green) 7.5k / 13" reel r2g 7.5k / 13" plastic reel m2g 1.8k / 7" reel f3g f4g 1.8k / 7" reel e3g 7.5k / 13" reel e2g 7.5k / 13" reel note: "x" is device code from "d" thru "j". reel size tape size reel size tape size byg20x (note) 1.8k / 7" reel r3g f2g 7.5k / 13" plastic reel
symbol a b c d e min max min max a 1.27 1.58 0.050 0.062 b 2.29 2.83 0.090 0.111 c 4.06 4.60 0.160 0.181 d 1.99 2.50 0.078 0.098 e 0.90 1.41 0.035 0.056 f 0.15 0.31 0.006 0.012 g 0.10 0.20 0.004 0.008 h 4.95 5.33 0.195 0.210 p/n = specific device code g = green compound yw = date code suggested pad layout unit(mm) 1.78 1.51 3.92 2.41 4.43 package outline dimensions dim. unit(mm) unit(inch) marking diagram
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